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arxiv_ai 85% Match Research Paper Materials Scientists,Computational Physicists,Metallurgists,AI Researchers in Materials Science 2 weeks ago

Clarifying the Ti-V Phase Diagram Using First-Principles Calculations and Bayesian Learning

graph-neural-networks › molecular-modeling
📄 Abstract

Abstract: Conflicting experiments disagree on whether the titanium-vanadium (Ti-V) binary alloy exhibits a body-centred cubic (BCC) miscibility gap or remains completely soluble. A leading hypothesis attributes the miscibility gap to oxygen contamination during alloy preparation. To resolve this disagreement, we use an ab initio + machine-learning workflow that couples an actively-trained Moment Tensor Potential with Bayesian inference of free energy surface. This workflow enables construction of the Ti-V phase diagram across the full composition range with systematically reduced statistical and finite-size errors. The resulting diagram reproduces all experimental features, demonstrating the robustness of our approach, and clearly favors the variant with a BCC miscibility gap terminating at T = 980 K and c = 0.67. Because our simulations model a perfectly oxygen-free Ti-V system, the observed gap cannot originate from impurity effects, in contrast to recent CALPHAD reassessments.
Authors (3)
Timofei Miryashkin
Olga Klimanova
Alexander Shapeev
Submitted
June 21, 2025
arXiv Category
cond-mat.mtrl-sci
arXiv PDF

Key Contributions

This work resolves the conflicting experimental data on the Ti-V phase diagram by employing a novel workflow coupling ab initio calculations with Bayesian learning. It constructs a robust phase diagram using an actively-trained Moment Tensor Potential and Bayesian inference of the free energy surface, clearly favoring a BCC miscibility gap and demonstrating that impurity effects are not the cause.

Business Value

Provides accurate and reliable phase diagrams for alloy systems, which is crucial for designing new materials with desired properties, optimizing manufacturing processes, and ensuring material reliability in various applications.